The new MAX 24 MP

[erickb]

The new MAX 24 MP sensor inside the Leica M "could possibly alter the product roadmaps and strategies of several companies"

http://leicarumors.com/2012/10/25/the-new-max-24-mp-sensor-inside-the-leica-m-could-possibly-alter-the-product-roadmaps-and-strategies-of-several-companies.aspx/

Leica FF CIS will be fabricated by CMOSIS' foundry partner STMicroelectronics. STMicroelectronics' IMG175 300 mm Cu process, developed for 1.75 µm mobile CIS, will be adapted to 6 µm pixels and use 0.11 µm design rules for the front end of line (FEOL) processing and 90 nm design rules for the BEOL. While Leica has nowhere near the market share of Japanese FF camera companies, the transition to sub 0.18 µm device production is an event that could possibly alter the product roadmaps and strategies of several companies.

http://www.chipworks.com/blog/technologyblog/2012/10/25/full-frame-dslr-cameras-part-iii-new-entrants-and-look-forward/